The MECHANIC 148°C PPD Solder Paste is a premium-quality, low-temperature solder paste engineered for precision electronic repairs and assemblies. Specially formulated for delicate tasks, it’s ideal for reworking and reballing high-density SMD components, particularly in modern smartphones like the iPhone X series. With a melting point of just 148°C, this solder paste minimizes heat damage risk to sensitive components.

Low Melting Point (148°C): Perfect for temperature-sensitive electronic components, reducing the risk of thermal damage.
Smartphone-Specific Formulation: Optimized for iPhone X series and similar high-end mobile devices, including layered motherboard designs.
Reliable Soldering: No false soldering or bridging – ensures clean, accurate joints.
Moderate Viscosity: Smooth application with excellent adhesion and minimal slumping.
Bright, Residue-Free Finish: Creates full, shiny solder points with no leftover flux or debris.
Excellent Wettability: Enhances solder flow and joint strength.

Soldering and reballing of SMD (Surface-Mount Devices)
Ideal for iPhone motherboard repairs, especially for multilayer designs
Suitable for precision reflow soldering in professional or advanced DIY setups
Application: Use a stencil or precision syringe to apply the paste to the target area.
Reflow: Heat to 148°C using a hot air station or reflow oven until the solder flows and bonds.
Safety: Ensure adequate ventilation during use to avoid inhaling fumes.
Type: Low-Temperature Solder Paste
Melting Point: 148°C
Viscosity: Moderate
Residue: Minimal to none
Package: [Specify container size, e.g., 10g, 50g jar/syringe – if known]
Professional smartphone technicians
Electronics hobbyists and rework specialists
Repair shops and PCB assembly tasks
Enhance your repair accuracy and protect delicate components with the MECHANIC 148°C PPD Solder Paste – the trusted choice for professional smartphone repair.
