The XG-Z40 Needle Solder Flux Paste (10CC) is a high-quality soldering accessory specially formulated for precision electronic repair tasks. Its advanced chemical composition and reliable performance make it ideal for mobile phone repairs, computer motherboard work, SMT board soldering, and BGA reballing.

Key Features:

• Advanced Chemical Formula: Offers excellent wettability and high reliability for consistent, high-quality soldering.

• Thixotropic Agent Technology: Prevents collapse during printing and preheating, ensuring clean, sharp solder patterns.

• Extended Working Time: Remains tacky for up to 48 hours without drying out, providing greater flexibility during repair work.

• Superior Soldering Performance: Delivers smooth, easy welds with bright, full solder joints. Reduces risks of cold or false soldering.

• Low Residue and No-Clean: Leaves a colorless, transparent residue that does not interfere with post-solder inspection. Excellent cleaning performance.

• Long Shelf Life: Maintains performance over time at room temperature storage conditions.

• Wide Application Range: Suitable for BGA chip planting, high-precision SMT work, and electronics repair industries.

Specifications:

• Model: XG-Z40

• Volume: 10CC

• Viscosity: 1 Pa·s

• Particle Size: 25–45 µm

• Alloy Composition: Tin

• Activity Level: Low

• Type: Lead

• Cleaning Angle: Plane

• Melting Point: 183°C

• Operating Temperature: 183°C

• Application: BGA chip planting, electronics soldering

Conclusion:
The XG-Z40 Needle Solder Flux Paste is a reliable, high-performance solution for precise electronic soldering. With excellent wettability, long working time, and low residue, it's ideal for professional repairs and BGA applications. Perfect for technicians seeking clean, efficient, and long-lasting results.