Premium Solder Paste for Precision Electronics Repairs – Especially Designed for iPhone X Series Layered Motherboards

Product Features:

• 100% Brand New & High Quality

• Specially developed for iPhone X / XR / Xs / Xs Max layered motherboards

• Ideal for high-end smartphone repairs in the communications industry

• Moderate viscosity for precise application and excellent control

• Not easy to de-weld or shift, ensuring stable and reliable solder joints

• Produces bright, full solder joints with no false connections

• Leaves no residue, ensuring a clean finish

• High wettability and outstanding weldability

Technical Specifications:

• Brand: MECHANIC

• Model: XP2

• Weight: 20g

• Melting Point: 148°C

• Alloy Composition: Sn63/Pb37 (Tin 63%, Lead 37%)

• Viscosity: 178 ± 10

• Particle Size Range: 20 – 38µm

• Application Type: Hot melt solder paste

 Applications:

• Professional BGA reballing

• Precision SMD/SMT soldering

• Repairs of layered or stacked PCB boards

• Especially effective for Apple logic boards and other high-density circuits