Ideal for mobile phone and PCB repair, especially when dealing with glue under chips or along pads
The flat‑cut design delivers a controlled, safe removal action
Made from high‑strength stainless steel, resisting bending or wear
Compact packaging and compatible with common blade holders
Helps technicians perform clean, precise work at the component level
Removing underfill glue from around IC chips during motherboard or logic board repair
Cleaning solder pads after chip removal to prepare for reballing or reinstallation
Working in tight spaces where precision and control are needed
Phone and tablet motherboard repair, especially on iPhones, iPads, and other high-density PCBs
Safe scraping of delicate areas without damaging nearby components or traces
