The 2UUL DA28 is a set of ultra‑thin, sharp blades made for electronics repair. These blades are specially designed to remove underfill glue and clean solder pads on circuit boards and IC chips without damaging nearby parts. They’re crafted from durable stainless steel and come in a pack of 5. Each blade fits standard precision handles, making it easy to swap in and out while working.

Key aspects:

Ideal for mobile phone and PCB repair, especially when dealing with glue under chips or along pads

The flat‑cut design delivers a controlled, safe removal action

Made from high‑strength stainless steel, resisting bending or wear

Compact packaging and compatible with common blade holders

Helps technicians perform clean, precise work at the component level

Ideal for:

Removing underfill glue from around IC chips during motherboard or logic board repair

Cleaning solder pads after chip removal to prepare for reballing or reinstallation

Working in tight spaces where precision and control are needed

Phone and tablet motherboard repair, especially on iPhones, iPads, and other high-density PCBs

Safe scraping of delicate areas without damaging nearby components or traces