The BH15 MagGrid Pad is a silicone buffer / magnetic soldering pad used in electronics and micro‑repair work (especially for BGA / CPU / IC level tasks). It’s designed to help with precise tin (solder) placement, stabilize the working parts, and improve heat handling.

 

Key Features & Highlights

 

Soft Silicone Material + Elastic Buffering
The pad is made of soft, heat‑resistant silicone that provides cushioning and some protection against mechanical stress. 

 

Magnetic Adsorption Support
It has built‑in magnetic attraction (or supports magnetic action) so that the steel mesh or stencil used for applying solder does not shift or fall during work. This helps stabilize your components. 

 

Heat Dissipation Design
The back of the pad includes hollow / vented holes or a “heat dissipation drum” structure for better cooling, preventing bulging or warpage of the mesh during soldering. 

 

High Temperature Resistance
The pad can withstand temperatures up to around 500 °C, making it suitable for high‑temperature soldering or rework.

 

Multiple Chip Slot Depths
It supports different IC / BGA chip thicknesses by providing slots / grooves of depths such as 0.3 mm, 0.4 mm, 0.5 mm, and 0.8 mm. This flexibility helps accommodate different chip heights.

 

Compact Size & Weight
Typical dimensions are approx 104 mm × 80 mm × 8 mm and net weight around ~ 65.5 g. 

 

Easy to Clean / Maintain
Because it is silicone, the surface is relatively easy to clean of solder residues.

 

What It’s Useful For / Ideal Use Cases

 

 

Applying solder paste / reballing on BGA / CPU / IC chips where you want the stencil to stay precisely aligned

 

Stabilizing the component / stencil during tin planting so that it doesn’t shift

 

Work requiring repeat heating where heat control / dissipation is important

 

Situations where you need to support chips of varying heights without damaging them

 

Repair shops or micro soldering setups where consistency, precision, and alignment matter