It’s a special solder paste (“jump-wire paste” / “solder tin paste”) designed for electronics work — especially delicate tasks like soldering jumper wires, fly-lines, or small connections on PCBs (e.g. phone motherboards).
The package is 3 mL volume.
Its intended melting / soldering temperature is ≈ 138 °C (some sources mention a working range up to ~158 °C) — comparatively “low temperature” for solder pastes.
High activity and good wetting: The paste is formulated so solder wets the metal surfaces easily and bonds reliably — essential for small, delicate joints.
Moderate viscosity: The paste is neither too runny nor too thick — this helps precise application (especially with fine solder needles) and prevents unwanted spreading or solder bridging.
Easy tinning: The paste allows soldering by merely touching with a soldering iron — the solder adheres (“tins”) reliably with minimal effort.
Good for fine, small-scale soldering jobs: Because of its low melting point and controlled flow, it’s ideal for jump-wire soldering, fly-lines, micro PCB repairs — situations where heat sensitivity and precision matter.
Repairing or installing jumper wires on mobile-phone motherboards or small electronics.
Micro soldering — e.g. repairing broken PCB traces, fly-lines, small pads or connectors.
Situations where you need low-temperature soldering to avoid damaging sensitive components. (Because 138 °C is relatively gentle compared to high-temp solders.)