LANRUI 007 Cold Blade CPU Competitive Shovel Scraper for iPhone CPU Glue Removal & IC Chip Repair Tool

•  Professional LANRUI 007 Cold Blade CPU Shovel Glue Knife - Precision Mobile Phone Motherboard Repair Tool

•  LANRUI 007 CPU Shovel Cold Blade - Thin High-Toughness Scraper for BGA IC Glue & CPU Cover Removal
 

LANRUI 007 Cold Blade CPU Shovel Glue Removal Knife

The LANRUI 007 Cold Blade CPU Shovel is a professional-grade precision tool designed for efficient and safe CPU/IC glue removal in mobile phone repair. Engineered with high-toughness alloy steel and advanced carbonization process, this cold blade offers exceptional durability, sharpness, and flexibility without the need for heating.

Key Features:

•  High Precision Cutting: Laser-cut double/single-edge blade design ensures low resistance, clean cuts, and minimal risk of damaging the motherboard, CPU, or surrounding components.

•  Strong Toughness: Premium metal alloy construction resists bending, deformation, and wear even with repeated use on tough adhesives and CPU covers.

•  Cold Blade Technology: Heat-free operation protects sensitive chips and PCBs while quickly removing iPhone CPU shields, thermal glue, underfill, and BGA IC adhesives.

•  Ergonomic & Efficient: Optimized for professional technicians — improves repair speed and success rate during CPU replacement, NAND repair, and motherboard rework.

•  Multi-Purpose Use: Ideal for iPhone, Android smartphones, tablets, and other electronics repair involving glue removal and chip prying.

Perfect For:

•  Mobile phone repair shops

•  CPU/IC transplant and BGA rework

•  Removing stubborn CPU glue and protective covers

•  Precision scraping on delicate electronics

Package Includes: 10PCS LANRUI 007 Cold Blade CPU Shovels (Box Packaging)

Upgrade your repair toolkit with the LANRUI 007 Cold Blade — the preferred choice for technicians seeking speed, precision, and reliability in CPU glue removal and IC repair tasks.