The 2UUL BH12 The One Plate is a professional magnetic curved reballing platform designed for precise BGA and IC chip repair on mobile phone motherboards. Featuring a unique curved design with a high-temperature resistant silicone pad, this tool ensures tight stencil adhesion and stable positioning during soldering and reballing work.

Key Features:

•  Strong Magnetic Force — Powerful magnets keep the stencil firmly attached to the platform for maximum stability

•  Curved Design — Special arc surface ensures better contact and prevents stencil warping

•  Heat-Resistant Silicone Pad — High-quality silicone provides excellent thermal protection and grip

•  Universal Compatibility — Works with various steel stencils and different motherboard/IC sizes

•  Two-Way Clamping Mechanism — V-slot design allows quick switching between different board types

•  Durable & Premium Build — Made for professional daily use in repair shops

Ideal for mobile repair technicians working on iPhone, Samsung, Xiaomi, and other smartphones. Perfect for CPU/GPU reballing, IC chip soldering, motherboard repairs, and stencil applications. The 2UUL BH12 solves common issues like poor stencil fit and chip movement, making your repair process faster, cleaner, and more reliable.

Perfect for: Mobile Phone Repair Shops, BGA Reballing, Motherboard Repair, Professional Technicians, Chip-Level Repair.