The Relife RL-093B 0.3mm Heat Sink Copper Sheet is a premium pure copper thermal pad designed for efficient heat dissipation during mobile phone repairs. With excellent thermal conductivity, these ultra-thin copper sheets quickly transfer heat away from chips, CPUs, and ICs, making them essential for protecting components during soldering, desoldering, and reballing processes.

Key Features:

•  0.3mm Thickness – Perfect balance of flexibility and durability (thicker than 0.1mm for better heat capacity)

•  High Thermal Conductivity – Rapid and uniform heat diffusion from chip to heat sink

•  Pure Copper Material – Superior heat transfer performance and corrosion resistant

•  Smooth Surface – No sharp edges or burrs, safe for precise applications

•  Pack of 50pcs – Economical bulk quantity for professional repair shops

•  Versatile Use – Ideal for softening underfill glue, protecting nearby components, and improving soldering success rates

This copper heat sink sheet is widely used by professional technicians for iPhone, Samsung, Xiaomi, and other smartphone motherboard repairs. It helps prevent chip overheating, reduces damage risk, and improves overall repair quality.

Perfect for: Mobile Phone Repair, Chip-Level Repair, BGA Reballing, Motherboard CPU/GPU Cooling, IC Desoldering, Professional Repair Technicians.
 

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