Discover the 2UUL FD40 Chip Heating Glue Removal Station, a compact and professional-grade mini heating platform designed for precision mobile phone repair. Featuring a 16x17mm heating surface, this lightweight tool (only 7g) efficiently softens underfill glue on CPUs, NAND Flash, PMICs, and BGA chips at 150-200°C.

Ideal for micro-soldering technicians, it reduces disassembly risks like pad lifting or motherboard damage by providing uniform, targeted heat. Compatible with C210 soldering handles, the FD40 makes chip removal, reballing, and rework faster and safer.

Key Features:

•  Precise 16×17mm heating block for common mobile ICs

•  Recommended temperature: 150°C–200°C

•  Ultra-compact design (90×23×5mm) – perfect for microscope work

•  Minimizes damage during glue removal and BGA chip disassembly

•  Lightweight and easy to attach with secure clamping

Essential tool for professional phone repair shops and technicians working on iPhone, Samsung, and other smartphone motherboards. Boost your repair success rate with the 2UUL FD40!