Amaoe MU-5 BGA Reballing Stencil for MTK CPU | 0.12mm Stainless Steel for Dimensity 8100/9000/1080 & More

Description:

Achieve precise, professional MediaTek (MTK) CPU reballing with the Amaoe MU-5 BGA Reballing Stencil. This high-precision 0.12mm stainless steel stencil is designed for accurate solder ball placement and tin planting on popular MTK processors used in modern Android smartphones and tablets.

Compatible Chipsets:

•  MT8795Z

•  MT6895Z (Dimensity 8100)

•  MT6877V (Dimensity 900 / 1080)

•  MT6855V (Dimensity 930)

•  MT6983Z (Dimensity 9000)

•  MT6799W

•  MT8176V

•  RAM496 / MT6799W RAM

Key Features:

•  0.12mm Ultra-Thin Stainless Steel — Superhard, deformation-resistant material for excellent heat resistance and long-term reusability.

•  High-Precision Laser-Cut Holes — Square-hole design ensures perfect alignment, uniform solder distribution, and reduced bridging risk.

•  Anti-Warp Construction — Maintains flat contact during heating for consistent, reliable reballing results.

•  Professional-Grade Tool — Ideal for chip-level motherboard repair, CPU/RAM rework, and BGA soldering on devices from Xiaomi, Realme, Vivo, Oppo, Infinix, Tecno, and more.

Perfect for mobile repair technicians and rework labs needing a durable, accurate stencil for MTK Dimensity and Helio series CPUs. Package includes 1 × Amaoe MU-5 Stencil.