Amaoe U-QSU6 is a high-precision 0.12mm stainless steel BGA reballing stencil designed for professional Qualcomm Snapdragon CPU rework.

It features laser-cut apertures for accurate solder ball placement and supports multiple modern Qualcomm processors in one integrated layout, including:

•  SM8750 (Snapdragon 8 Gen 3)

•  SM8635 (Snapdragon 8s Gen 3)

•  SM7635 (Snapdragon 7s Gen 3)

•  SM8650

•  SM7550 (Snapdragon 7 Gen 3)

•  SM6450 (Snapdragon 6 Gen 1)

•  SM4450 (Snapdragon 4 Gen 2)

•  SM7435

•  BGA496 layout

Made from durable, high-temperature resistant Japanese-grade stainless steel with an anti-warp design. Ideal for mobile repair technicians performing precise BGA reballing and solder paste application on Qualcomm CPUs. Reusable and built for professional use.