Restore damaged solder pads and perform precise BGA rework with the LANRUI CT80 Fill Active Solder Balls – professional-grade micro solder beads designed specifically for Android motherboard repair.

These high-precision active solder balls offer an efficient alternative to traditional jumper wires. Simply place one bead on the damaged pad and heat it to create a strong, reliable solder joint. With approximately 25,000 pieces per bottle, this bulk pack is ideal for busy repair shops and technicians handling multiple Android devices.

Key Features:

•  Ultra-Precise Diameter Control – Strict 8μm tolerance (far tighter than the industry standard of 10–25μm) for consistent, high-quality solder joints

•  Android-Optimized (CT80) – Specifically formulated for Android motherboard pads and patch repairs

•  One Bead Per Pad – Simplifies repairs, reduces time, and eliminates the need for messy jumper wires in many cases

•  Anti-Static & High Yield – Static-free design with excellent physical properties for precision micro-soldering

•  Lead-Free & Eco-Friendly – Safe alloy suitable for modern electronics repair standards

•  Bulk Supply – 25,000 pcs per bottle provides long-lasting value for professional use

•  Reliable Performance – Smooth spherical shape, stable melting, good conductivity, and strong bonding for IC chips, BGA components, and PCB pad restoration

Ideal For:

•  Repairing broken or lifted solder pads on Android motherboards

•  BGA reballing and IC chip rework

•  Mobile phone PCB maintenance and micro-soldering

•  Professional GSM and electronics technicians

Specifications:

•  Model: LANRUI CT80 (Android version)

•  Type: Fill Active Solder Balls / Micro BGA Solder Beads

•  Quantity: Approx. 25,000 pcs per bottle

•  Diameter Tolerance: ±8μm

•  Application: Android motherboard solder pad repair, BGA rework, IC soldering

•  Features: Anti-static, high precision, lead-free compatible

How to Use:

1.  Clean the damaged pad area thoroughly.

2.  Place a single active solder ball on the repair point.

3.  Apply heat with a soldering iron or hot air station until the ball melts and forms a solid joint.

4.  Allow to cool and inspect the connection.

The LANRUI CT80 Active Solder Balls help technicians achieve clean, durable repairs with greater speed and consistency compared to traditional methods.

Package Includes: 1 × Bottle of LANRUI CT80 Fill Active Solder Balls (approx. 25,000 pcs)

Perfect for Android phone repair professionals looking for a precise, efficient, and cost-effective solution for motherboard pad and BGA work.