Buy Mechanic iTin-12 BGA Reballing Stencil Magnetic Tin Plating Platform. Strong magnetic hold, high-temp resistant, non-slip design for precise mobile motherboard & IC chip repair. Includes 2 blades.
 

Mechanic iTin-12 BGA Reballing Stencil Magnetic Tin Plating Platform

The Mechanic iTin-12 is a professional-grade magnetic BGA reballing and tin plating platform designed for precise chip-level repair work. Built for mobile phone motherboard and computer IC technicians, this compact platform delivers rock-solid stability, perfect stencil alignment, and smooth solder paste application every time.

Whether you’re performing BGA reballing, tin planting, or preparing CPU/IC chips, the iTin-12 eliminates stencil movement and ensures consistent, high-quality results.

Key Features

•  Powerful Magnetic Grip – Strong magnets lock the BGA stencil firmly in place with zero deviation for pinpoint precision.

•  Flat Non-Slip Platform – Smooth surface allows effortless scraping and even solder paste distribution in a single pass.

•  Anti-Slip Silicone Base – Keeps the entire platform stable on the workbench during precise reballing work.

•  High-Temperature Resistant – Durable construction withstands continuous high heat without warping or deforming.

•  Universal Compatibility – Ideal for smartphone motherboards, laptop chips, CPUs, and various BGA components.

•  Compact & Workshop-Friendly – Lightweight and space-saving design perfect for professional repair

Technical Specifications

Model: Mechanic iTin-12
Type: Magnetic Tin Plating / BGA Reballing Platform
Size: Approx. 90 × 130 × 8.5 mm
Material: High-grade metal body with magnetic base
Heat Resistance: High-temperature resistant
Package Includes: 1 × Reballing Platform + 2 × Precision Blades