QUICK 857DW+ LEAD-FREE ADJUSTABLE SMD REWORK STATION 100% ORIGINAL

Features:

• Quick 857DW+ Lead Free Adjustable SMD Rework Station 100% Original Easy to use. the airflow linear regulator, mains airflow can be kept stable when there is a change, the double vortex rotating wind, the wind gentle, there is no impact.
• heating express, three seconds to reach the set temperature, the temperature of the liquid crystal display, intelligent sensors, automatic cooling, and delay shutdown.
• blow welding with plastic components, ringer, insert the end of the inline blocks and other non-deformation, blow welding circuit board not sparkling.
• Demolition of the shield does not change color
• blowing the BGA chip easily broken.\nClosed-loop sensor: Temperature can be controlled by zero voltage triggering mode.
• The large power and rapid heating: Temperature can be conveniently adjusted and the temperature is accurate and stable, and not affected by airflow.
• Step-less airflow adjusting with a wide range: Temperature can be conveniently adjusted.
• The sensitive electromagnetic inductor in handle: Ensures the unit begins working immediately so long as the handle is held. when the handle is put on the holder, The system will return to standby mode.
• Automatic cooling system: This can increase the life of the heating element and protect the unit.
• The compact unit takes up little space on the workbench.
• QUICK 857DW+ Lead-Free Adjustable Hot Air Heat Gun With Helical Wind 580W
• linear air volume adjustment, mains have to change the air volume can be stable, double vortex spinning wind, the wind is soft, no impact.
• express of temperature, 3 seconds to reach the set temperature, the temperature of liquid crystal display (LCD), intelligent sensor, automatic cooling,
• delay shutdown.
•  welding with plastic components, ringer, such as the tail inserted inline deformation, welding circuit board no bubbles. The shield does not change colour\nBGA chip is not easy to break.

Product use:\nsuitable for a variety of components desoldering. Such as SOIC, CHIP, QFP, PLCC, and BGA, etc.\nused in thermal shrinkage, and drying, in addition to the paint, in addition, to sticking, thawing, reheating, disinfection, plastic welding, etc.