KAISI 183 HIGH QUALITY SOLDER PASTE PPD PASTE 40GM TEMPERATURE 183℃
PRODUCT NAME: （183°）
HIGH QUALITY SOLDER PASTE
STRONG TIN DRAG, GOOD CONDUCTIVITY, NO CLEANING.
GOOD WETTABILITY, FULL SOLDER JOINTS, BRIGHT AND EVEN SOLDER JOINTS.
PRINTING IN PCB CAN STILL MAINTAIN ITS VISCOSITY FOR A LONG TIME WITHOUT DEFORMATION AND COLLAPSE.
FOR CIRCUITS WITH SPACING OF 0.3MM AND ABOVE, EXQUISITE PRINTING CAN BE COMPLETED.
40g KAISI 183℃
bottle 1 pieces KAISI 183℃
40g
1 bottles KAISI 183℃
PRECAUTION
1.READ MSDS AND TECHNICAL DATA BEFORE USE.
2.AVOID BREATHING IN FUMES WHEN SOLDERING.
3.KEEP OUT OF REACH OF CHILDREN
4. WASH HANDS ATFER SOLDERING.
5.FOR INDUSTRIAL USE ONLY.
SOLDER PASTE (G)
MELTING POINT: 183°C 1 bottles KAISI 183℃
Usage/Application
For Soldering
Weight
40 GRAM
Model Name/Number
Kaisi 183 DEGREE
Warranty
TESTING
Product Description
Kaisi 40g 183°C High-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair
Features:
Package includes:
