MECHANIC XZ10 0.65mm solder ball Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools The BGA solder ball has the following characteristics:
Feature:
1. MECHANIC solder ball 10000PCS/Bottle
2. Composition: Sn63/Pb37 ( 63% tin / 37% lead )
3. Meet EU ROHS and REACH standards.
4. With high reliability, excellent mechanical properties, good thermal fatigue resistance, and oxidation resistance.
5. Purity and sphericity are very high, with no surface defects.
6. Suitable for BGA, CSP, and other cutting-edge packaging technology and the use of micro-welding.
7. The minimum diameter of the solder ball is 0.65mm, non-standard sizes can be customized according to customer requirements.
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